- All sections
- B - Performing operations; transporting
- B23K - Soldering or unsoldering; welding; cladding or plating by soldering or welding; cutting by applying heat locally, e.g. flame cutting; working by laser beam
- B23K 26/12 - Working by laser beam, e.g. welding, cutting or boring in a special environment or atmosphere, e.g. in an enclosure
Patent holdings for IPC class B23K 26/12
Total number of patents in this class: 850
10-year publication summary
|
59
|
75
|
91
|
89
|
91
|
86
|
96
|
78
|
63
|
17
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Seurat Technologies, Inc. | 126 |
29 |
| Velo3D, Inc. | 143 |
26 |
| Applied Materials, Inc. | 16587 |
16 |
| IPG Photonics Corporation | 494 |
15 |
| Samsung Display Co., Ltd. | 30585 |
14 |
| TRUMPF Werkzeugmaschinen GmbH + Co. KG | 585 |
13 |
| The Boeing Company | 19843 |
10 |
| ArcelorMittal | 1887 |
10 |
| Renishaw plc | 739 |
10 |
| General Electric Company | 18133 |
9 |
| Mitsubishi Heavy Industries, Ltd. | 8217 |
9 |
| Foro Energy, Inc. | 104 |
9 |
| Toshiba Corporation | 12017 |
8 |
| Jsw Aktina System, Co., Ltd. | 61 |
8 |
| Disco Corporation | 1745 |
7 |
| Gigaphoton Inc. | 1120 |
7 |
| Rtx Corporation | 8674 |
7 |
| Honda Motor Co., Ltd. | 24537 |
6 |
| Medtronic, Inc. | 9964 |
6 |
| Mitsubishi Electric Corporation | 43934 |
6 |
| Other owners | 625 |